Modular computer

ABSTRACT

A modular information handling system includes an upper chassis having a display and a power supply, and a lower chassis having a motherboard, memory, a processor, and a number of drive bays. The upper and lower chassis are interdependent, neither capable of functioning without the other. The upper and lower chassis are separately manufacturable, separately serviceable, and separately shippable.

FIELD

The present invention relates generally to personal computers, and morespecifically to multi-piece personal computers.

BACKGROUND

As more and more homes become equipped with personal computers, and asmore and more computer peripheral devices and uses for computers arise,personal computers have become unwieldy and increasingly more complex toassemble. For example, a typical desktop computer system has a centralprocessing unit (CPU) which houses a motherboard, memory, storage suchas a hard drive or drives, a floppy drive, a power supply, add-onperipherals such as a modem, CD-ROM drive, DVD-ROM drive, tape backup,and the like. Such peripherals are often internal to the housing, butmay also be connected externally. Other usually external peripheralsinclude a pointing device such as a mouse, a keyboard, speakers,printers, microphones, and the like. Each of the components must beconnected to the CPU, most often with cables or the like. In someinstances, for example the Destination computer system manufactured byGateway, Inc., some peripheral components are connected to the CPU via awireless link.

In addition to all the peripherals connected to a CPU, a display devicesuch as a monitor is also connected to the computer. Monitors typicallyhave their own power supply connected to their own source of power usinga power cord. Such power is usually supplied by connection to a standardwall outlet. The CPU power supply is also connected to a standard walloutlet to supply its power supply with electricity.

Cabling must also typically be connected between the CPU and the monitorto transfer signals back and forth between the monitor and the CPU. Suchconnections require the user to determine which cable attaches to whichport, and require time and effort if the computer is to be moved fromits location to another location. Further, cables such as power cordsare potentially subject to abuse including bending, compression,fraying, gnawing by pets or rodents, and the like.

There is therefore a need in the art for a monitor easily connectable toa CPU without the need for cabling.

There is also a need in the art for a computer that is easily andquickly upgradeable with low amounts of down time.

SUMMARY

The present invention overcomes the problems of the art by providing inone embodiment an information handling system having two modules, anupper module and a lower module, which are interdependent. The upper andlower modules each contain components necessary for the operation of theassembled computer system. Without each other, the modules do not haveindependent functionality.

In one embodiment, a computer includes a lower chassis having amotherboard, drive bays, and a lower chassis blind mate connector forconnecting the lower chassis to an upper chassis, and an upper chassishaving a power supply, a monitor, and an upper chassis blind mateconnector, the lower and upper chassis connectable by the blind mateconnectors to pass signals and power therebetween.

In another embodiment, the lower chassis has a number of guide pinswhich when the lower and upper chassis are assembled together engage amating number of guide pin openings to align the upper and lowerchassis. In this alignment, the blind mate connectors of the upper andlower chassis also engage one another without the need for cabling,providing an operable system.

Other embodiments are described and claimed.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a perspective view of one embodiment of the present invention;

FIG. 2 is an exploded perspective view of the embodiment of FIG. 1;

FIG. 3 is a bottom view of an upper chassis embodiment of the presentinvention;

FIG. 4 is a top view of a lower chassis embodiment of the presentinvention; and

FIG. 5 is a view showing the assembly of an embodiment of the presentinvention.

DESCRIPTION OF THE EMBODIMENTS

In the following detailed description of embodiments, reference is madeto the accompanying drawings which form a part hereof, and in which areshown by way of illustration specific embodiments in which the inventionmay be practiced. These embodiments are described in sufficient detailto enable those skilled in the art to practice the invention, and it isto be understood that other embodiments may be utilized and logical,structural, electrical, and other changes may be made without departingfrom the scope of the present invention.

FIG. 1 shows a perspective view of a computer 100 according to oneembodiment of the present invention. Computer 100 is a modular computerhaving, a lower chassis 102 and an upper chassis 104. Lower chassis 102and upper chassis 104 fit together to form a substantially smooth outersurface 106 at the connection point 108. In other words, the lowerchassis 102 and the upper chassis 104 are substantially flush to oneanother when the computer 100 is assembled.

In one embodiment, lower chassis 102 comprises a housing containing amotherboard 103 having a processor, memory, expansion slots such as PCIand ISA expansion slots, and associated circuitry and modules such as amodem, sound card, video card, and the like. Further, the lower chassis102 contains bays for drives such as a floppy drive 110, a CD-ROM orDVD-ROM drive 112, a tape backup unit, and the like. Also, bays forinternal drives such as a hard drive are contained in lower chassis 102.Lower chassis 102 further includes a connector port for connection to anexternal supply of power, as in this embodiment, lower chassis does notcontain a power source. In one embodiment, the lower chassis also hasconnection ports for external peripheral devices. Such connection portsare in one embodiment universal serial bus (USB) ports 115.

In this embodiment, upper chassis 104 contains a display 114 and a powersupply. The power supply is connectable to a source of power such asstandard electrical current from a house electrical outlet. AC power isreceived into the upper chassis. The AC line in is split. AC power goesto the display to power the display, and to the power supply. The powersupply converts AC power to DC power for use by the remaining componentsof the computer 100. The upper chassis further includes a connector portfor connection to an external motherboard or CPU. The connector port isoperatively connected to the power supply to provide only DC power tothe connector port for connection to another connection port for thelower chassis.

In this embodiment, the connector ports of the lower and upper chassisare operatively connectable to each other, the lower chassis receivingsolely DC power through the upper chassis connector port to itsmotherboard to provide operating power for the processor, memory,associated circuitry and modules, internal drives, and the like. Theupper and lower chassis also transfer operating signals back and forthbetween the upper and lower chassis via the connection of theirrespective connector ports.

The upper and lower chassis are connected together operatively by theconnector ports. In one embodiment, the connector ports are blind mateconnector ports. When the upper and lower chassis are assembledtogether, the blind mate connectors of the upper and lower chassis matewith one another to connect the upper and lower chassis togetheroperatively. No cabling or cords are necessary in this embodiment toconnect the upper and lower chassis together, yet a full size cathoderay tube (CRT) may be used to provide the display.

In this embodiment, neither of the modules, upper or lower, willfunction without the other. The two modules are interdependent.

FIG. 2 shows a front elevation view of the computer 100 in an explodedfashion, with lower chassis 102 and upper chassis 104 separated. Theupper and lower chassis connect physically together in one embodimentusing a plurality of guide pins and guide pin openings. Guide pins 116on the lower chassis engage guide pin openings 118 on the upper chassiswhen the upper and lower chassis are assembled together. To furtherassist in the alignment of the upper chassis 104 and the lower chassis102, in one embodiment, tabs 126 on lower chassis 102 engage slots ortab openings 128 on upper chassis 104. The tabs 126 and tab openings 128are best seen in FIGS. 3 and 4.

Upper chassis 104 has power supply 305. Lower chassis 102 hasmotherboard 405, memory 410, and processor 415.

Further alignment is provided in one embodiment by mating tabs 127 and129 on the lower chassis 102 and upper chassis 104 respectively, as isbest shown in FIGS. 2, 3, 4, and 5. Tabs 127 engage tabs 129 to assistin alignment of the upper and lower chassis. It should be understoodthat the location of the tabs can be adjusted, and the tabs switchedbetween the upper and lower chassis, without departing from the scope ofthe invention.

Assembly of the modular components 102 and 104 of computer 100 is shownin FIG. 5. The upper chassis module 104 is inverted so that its bottomsurface 130 is facing substantially upward. Lower chassis module 102 isalso inverted. Two guide pins 116 along one edge 132 of the lowerchassis 102 are aligned with mating guide pin openings 118 also alongone edge 134 of the upper chassis with the lower chassis beingpositioned at an angle alpha with respect to the surface 130 of theupper chassis. When the guide pins 116 along edge 132 meet with andengage the guide pin openings 118 along edge 134 of the upper chassis104, the remaining connections of the upper and lower chassis, that isthe blind mate connectors and the remaining guide pins and guide pinopenings, are readily made. In one embodiment, fasteners such as quickrelease fasteners, thumb screw fasteners, screws or the like are used tofully secure the upper and lower chassis together.

In the rotation of the lower chassis to engage fully the guide pins 116of lower chassis 102 with the guide pin openings 118 of upper chassis104, the blind mate connector 120 of lower chassis 102 operativelycouples with a blind mate connector 122 of upper chassis 104 (as seen inFIG. 3), operatively coupling the upper and lower chassis fortransmission of power and computer signals between the upper and lowerchassis. Power supply 124 in upper chassis 104 is responsible in thisembodiment for receiving AC power from a standard source such as a walloutlet, supplying appropriate AC power to the display 114, converting ACpower into appropriate DC power and supplying that DC power to the blindmate connector 122 (as seen in FIG. 3) so as to provide DC power to themotherboard 103 and its connected peripherals and drives.

The embodiments of the present invention have a number of advantagesover other known computer configurations. For example, no cabling orwiring is required to connect the upper chassis 104 to the lower chassis102 to provide a connection of the power supply to the motherboard, andto supply the necessary signals to the display to allow it to properlydisplay information.

Additionally, the modular nature of the upper and lower chassisconfiguration allows for ease of servicing, replacement, repair, andupgrade of the computer. For example, an entire motherboard completewith new processor, video card, modem, drives, and the like can beswapped by replacing the lower chassis. In this embodiment, a user'sdrives containing information can easily be removed from one lowerchassis and inserted into another lower chassis. The defective orreplaced lower chassis may then be serviced or salvaged at a later time.The down time of a user's computer can be reduced by swapping in a newor replacement lower chassis. Similarly, the lower chassis may be sentfor servicing without the need for sending or shipping a display, whichcan subject the display to unnecessary jarring or damage. Further, thecomputer embodiments described herein reduce the weight and dimensionsof the system, reducing the shipping costs for both shipping newsystems, and for returns for servicing such as repair or upgrade. Mostof the components that need servicing are contained within the lowerchassis, which is smaller and lighter than traditional CPUs.

Advantages of the modular computer design embodiments described aboveare also evident in manufacturing. The modules can be manufacturedseparately from one another, and can therefore be assembled and shippedfrom different locations.

Further advantages of the modular computer system embodiments of abovebecome evident when international shipping of the computer is to bemade. Many countries place high tariffs on computer systems when theyare imported into the country. Typically, a computer system is definedas including a processor, a power supply, memory, and a motherboard. Inother words, a computer is defined as a fully operation system, withouta requirement that the system have a monitor. The embodiments of thepresent invention are not functional systems without one another.Neither the lower chassis nor the upper chassis is operational withoutthe other component. Both components must be present in order for thesystem to operate. Therefore, neither of the modules is a computer asthat term is defined by most countries, shipping them internationally.

Another advantage of the modular computer embodiments described above isthat since the DC power to operate the lower chassis is supplied throughthe blind mate connection to the upper chassis, servicing the lowerchassis will necessarily involve removing the power connection to thelower chassis. Therefore, the chances of shock or injury due to power inthe lower chassis will be reduced.

The lower chassis in one embodiment is limited to the use of DC power topower its components. Because only DC power is used in this embodiment,the Underwriters Laboratory (UL) specifications for electroniccomponents using AC power, which are more stringent than those for DCpower, need not be met. This increases the availability of materials andstructures that can be utilized for the lower chassis.

Air passages for cooling are disposed about the upper and lower chassis.Further, forced air cooling is also used to cool the upper chassis. Inone embodiment, low heat components are used in the lower chassis.Cooling of the lower chassis is then accomplished without a fan byconvection. Heat from the display vents upward, causing convectivecurrents to cool the lower chassis as warm air rises.

Because of the modularity of the components of the embodiments of theinformation handling system, numerous business advantages are obtained.Included by way of example only and not by way of limitation, businessadvantages to the modular information handling system embodiments of thepresent invention are in the manufacturing areas, shipping areas, andservice areas.

In the manufacturing area, the modules or chassis are in one embodimentmanufactured at different locations, and need not be pre-assembled fortesting. Instead, shipping is accomplished directly from themanufacturing location to the user. This reduces overall shipping costs,since components are often manufactured at different locations, and arecurrently all congregated for testing at one location before shipping.

In the shipping areas, import and export tariffs are reduced by theinterdependent functions of the modules in that neither module willtypically be classified as a computer. Instead, the classification willbe as components not subject to computer system tariffs.

In the service area, both upgrade and repair are improved with theembodiments of the present invention. Upgrading is accomplished in oneembodiment by having the manufacturer ship an entire lower chassis tothe user for replacement of the original lower chassis. In thisembodiment, the motherboard, memory, and the like can all be upgraded.The user simply removes the mass storage from the original component andinstalls it in the new component. Very little down time occurs. The userthen ships the original component back to the manufacturer for salvageor the like.

Repair is also more easily effected with the embodiments of the presentinvention. Most of the components or parts to be repaired in a typicalcomputer system are situated in the embodiments of the present inventionin the lower chassis. The reduced size and weight of the lower chassismakes it easier and less expensive to ship to the manufacturer forrepairs. This reduces costs and inconvenience for the user.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement which is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. This application isintended to cover any adaptations or variations of the invention. It isintended that this invention be limited only by the following claims,and the full scope of equivalents thereof.

What is claimed is:
 1. A computer, comprising: a lower chassis having amotherboard, drive bays, and a lower chassis blind mate connector,wherein the motherboard, the drive bays, and the lower chassis blindmate connector are connected to the lower chassis; an upper chassishaving a power supply, a display, and an upper chassis blind mateconnector, the lower and upper chassis connectable by the blind mateconnectors to pass signals therebetween, wherein the power supply, thedisplay, and the upper chassis blind mate connector are connected to theupper chassis, wherein the upper chassis is disposed on top of the lowerchassis, and wherein the lower chassis is disposed beneath and supportsthe weight of the upper chassis.
 2. The computer of claim 1, wherein thelower chassis has a plurality of guide pins extending therefrom, andwherein the upper chassis has a plurality of mating guide pin openingsfor connecting the upper and lower chassis.
 3. The computer of claim 1,wherein the upper chassis further comprises an AC to DC power converter,and the blind mate connector passes only DC power to the lower chassis.4. A lower computer module, comprising: a housing, wherein the housingis configured to be disposed below and support the weight of an uppercomputer module; a motherboard connected to the housing; a plurality ofexpansion drive bays connected to the housing; and a connector forconnection to an external power supply, wherein the connector isconnected to the housing.
 5. An upper computer module, comprising: ahousing, wherein the housing is configured to be disposed above and reston a lower computer module; a display device connected to the housing; apower supply connected to the housing, wherein the power supply iscapable of supplying AC and DC power; and a connector for connection toan external processor, wherein the connector is connected to thehousing.
 6. A computer, comprising: a first chassis comprising amotherboard, a processor, memory, and a first connector port, the firstconnector port operatively connected to the motherboard and capable ofreceiving DC power from an external power supply, wherein themotherboard and the first connector port are connected to the firstchassis; a second chassis comprising a display, a power supply, and asecond connector port, the second connector port operatively connectedto the power supply to receive DC power from the power supply, whereinthe display and the power supply are connected to the second chassis,wherein the second chassis is disposed on top of the first chassis, andwherein the first chassis is disposed beneath and supports the weight ofthe second chassis; wherein the first and second connector ports areconnected when the first chassis is coupled to the second chassis toallow passage of power and signals between the first and the secondchassis.
 7. The computer of claim 6, wherein the first chassis has guidepins and the second chassis has guide pin openings mating with the guidepins to assemble the computer.
 8. The computer of claim 6, wherein thefirst and the second chassis fit substantially flush with one another.9. The computer of claim 6, wherein the power supply receives externalAC power and transmits AC power to the display, and wherein the powersupply includes an AC to DC converter which supplies DC power to thesecond chassis connector port and to the first chassis via the firstchassis connector port.
 10. An information handling system, comprisingan upper chassis comprising a display and a power supply, wherein thedisplay and the power supply are connected to the upper chassis; and alower chassis comprising a processor, motherboard, memory, and aplurality of drive bays, wherein the upper and lower chassis sharecomponents dependent for operation of either chassis, and wherein theprocessor, motherboard, and the plurality of drive bays are connected tothe lower chassis, wherein the upper chassis is disposed on top of thelower chassis, and wherein the lower chassis is disposed beneath andsupports the weight of the upper chassis.
 11. The information handlingsystem of claim 10, wherein the upper and lower chassis are connectablewithout cabling.
 12. A method of doing business, comprising: supplyingat least two modular interdependent information handling systemcomponents, each component requiring the other for operation, thecomponents capable of service separate from one another, wherein thefirst component comprises a motherboard, a processor, memory, and afirst connector port, the first connector port operatively connected tothe motherboard and capable of receiving DC power from an external powersupply, wherein the motherboard and the first connector port areconnected to the first component, and wherein the second componentcomprises a display, a power supply, and a second connector port, thesecond connector port operatively connected to the power supply toreceive DC power from the power supply, wherein the display and thepower supply are connected to the second component, wherein the secondcomponent is disposed on top of the first component, and wherein thefirst component is disposed beneath and supports the weight of thesecond component; and swapping for a new modular component when afailure of one of the components occurs.
 13. A method of manufacturingan information handling system, comprising: manufacturing a lowerchassis having a housing, a motherboard, memory, a plurality ofexpansion drive bays, and a connector for connection to an externalsupply of DC power, wherein the motherboard, the memory, and theplurality of expansion drive bays are connected to the housing of thelower chassis; manufacturing an upper chassis having a housing, adisplay, and a power supply, wherein the upper chassis is manufacturedat a different location than the lower chassis, and wherein the displayand the power supply are connected to the housing of the upper chassis,wherein the upper chassis is manufactured to be disposed on top of thelower chassis, and wherein the lower chassis is manufactured to bedisposed beneath and support the weight of the upper chassis; andshipping the lower and the upper chassis directly to a customer withoutpre-assembly of the upper and lower chassis.
 14. A method of servicing amodular information handling system, comprising: replacing a defectivechassis of a two chassis information handling system by shipping a fullreplacement chassis to a user so as to reduce user system down time,wherein the two chassis information handling system comprises a lowerchassis having a motherboard, drive bays, and a lower chassis blind mateconnector, wherein the motherboard, the drive bays, and the lowerchassis blind mate connector are connected to the lower chassis, and anupper chassis having a power supply, a monitor, and an upper chassisblind mate connector, the lower and upper chassis connectable by theblind mate connectors to pass signals therebetween, wherein the powersupply, the monitor, and the upper chassis blind mate connector areconnected to the upper chassis, wherein the upper chassis is disposed ontop of the lower chassis, and wherein the lower chassis is disposedbeneath and supports the weight of the upper chassis; and returning thedefective chassis to a manufacturer.
 15. The method of claim 14, andfurther comprising: removing a mass storage device from the defectivechassis; and installing the mass storage device into the replacementchassis.